New Substrate Material for Flexible Electronics Could Help Combat E-Waste

Electronic waste, or e-waste, is a rapidly growing global problem, and it’s expected to worsen with the production of new kinds of flexible electronics for robotics, wearable devices, health monitors, and other new applications, including single-use devices.

A new kind of flexible substrate material developed at MIT, the University of Utah, and Meta has the potential to enable not only the recycling of materials and components at the end of a device’s useful life, but also the scalable manufacture of more complex multilayered circuits than existing substrates provide.

[READ MORE]

Prof. Chandran has been recently awarded new Phase II ARPA-E

Prof. Chandran has been recently awarded new Phase II funding (~$3M) for his ARPA-E project on the design and development of high temperature niobium alloys for gas turbines and other structural applications. The Phase II funding will make the cumulative ARPA-E funding, since 2021, as about $4.5M. Dr. Chandran’s proposal was one of the four selected and funded after the Phase II competition nationwide. Significant accomplishments of Chandran’s group in Phase-I practical alloy development, as well as plans for commercialization by a leading commercial producer, have been the major factors for the Phase II award. The research will support several graduate students in Dr. Chandran’s group. The ARPA-E funding also supports the acquisition of advanced mechanical testing equipment and a high temperature vacuum heat-treating furnace, with a cost of about $0.5M, in support of the advanced physical metallurgy research in the department.